BE Semiconductor Industries N.V. (BSI.F)

139,90 +3,40 (+2,49%) Börsenschluss: 08:55AM CEST

BE Semiconductor Industries N.V.

Ratio 6
Duiven 6921 RW
Netherlands
31 26 319 4500
https://www.besi.com

Sektor(en): Technology
Branche: Semiconductor Equipment & Materials
Vollzeitmitarbeiter: 1.736

Leitende Angestellte

Name	Titel	Zahlen	Ausgeübt	Geburtsjahr
Mr. Richard W. Blickman	Chairman of Management Board, President & CEO	1,88M	N/A	1954
Mr. Leon Verweijen	Senior Vice President of Finance	N/A	N/A	1976
Mr. Henk-Jan Jonge Poerink	Senior Vice President of Global Operations	N/A	N/A	1970
Edmond Franco	Vice President of Corporate Development	N/A	N/A	N/A
Mr. Rene W. Hendriks	Senior Vice President of Sales - North America & Europe	N/A	N/A	1961
Mr. Peter Wiedner	Senior Vice President of Sub Micron Die Attach	N/A	N/A	1970
Mr. Jong Kwon Park	Senior Vice President of Sales & Customer Support - APAC	N/A	N/A	1966
Mr. Jeroen Kleijburg	Senior Vice President of Packaging	N/A	N/A	1974
Mr. Christoph Scheiring	Senior Vice President of Die Attach	N/A	N/A	1970
Andrea Kopp-Battaglia	Senior Vice President of Finance- Die Attach	N/A	N/A	1978

Die Beträge haben den Stand 31. Dezember 2023 und Kompensationswerte gelten für das letzte Geschäftsjahr bis zu diesem Datum. Der Lohn umfasst Gehalt, Boni usw. „Ausgeübt“ entspricht dem Wert von Optionen, die im Lauf des Geschäftsjahrs ausgeübt werden. Währung in EUR.

Beschreibung

BE Semiconductor Industries N.V. engages in the development, manufacture, marketing, sale, and service of semiconductor assembly equipment for the semiconductor and electronics industries in China, the United States, Malaysia, Ireland, Korea, Taiwan, Thailand, Other Asia Pacific and Europe, and internationally. It operates through three segments: Die Attach, Packaging, and Plating. The company's principal products include die attach equipment, such as single chip, multi-chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra-thin, and wafer level molding, as well as trim and form, and singulation systems. It also provides plating equipment, such as tin, copper, and precious metal and solar plating systems, as well as related process chemicals; and tooling, conversion kits, spare parts, and other services. The company's principal brand names include Datacon, Esec, Fico, and Meco. It offers its products primarily to multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies. BE Semiconductor Industries N.V. was incorporated in 1995 and is headquartered in Duiven, the Netherlands.

Corporate Governance

BE Semiconductor Industries N.V.s ISS Governance QualityScore, Stand 1. April 2024, lautet 1. Die grundlegenden Scores sind Audit: 6, Vorstand: 1, Shareholderrechte: 6, Kompensation: 2.

Corporate-Governance-Bewertungen von Institutional Shareholder Services (ISS). Die Werte geben den Zehntelwert im Verhältnis zum Index oder zur Region an. Ein Zehntelwert von 1 zeigt geringeres Governance-Risiko, 10 höheres Governance-Risiko.